Recently, the national finals of the 9th National College Students Embedded Chip and System Design Competition were held at the Nanjing Integrated Circuit Training Base. Teams from Guangxi University (GXU) won one national first prize, one second prize, and two third prizes. Among them, the first-prize project also received the “HiSpark Best Application Award,” and GXU was named an “Outstanding Organization Award” recipient.

In the HiSilicon competition track, GXU’s entry, ”NearMeet Badge,” won recognition from the judges for its solid engineering-oriented design and clear commercial prospects, earning both a national first prize and the “HiSpark Best Application Award.” The team was also invited to take part in an interview featuring outstanding HiSilicon projects.

The competition was organized by the Chinese Institute of Electronics and brought together leading chip companies from China and abroad to propose challenges. Focusing on key development directions such as artificial intelligence, edge computing on the device side, and embedded intelligent robotics, the competition aimed to guide the cultivation of embedded chip talent in universities according to industry needs.

This year’s contest attracted more than 17,000 teams from 908 universities nationwide, setting new records in both scale and project quality. After the preliminary round and the semifinals held across six regional divisions, 1,227 teams advanced to the national finals. In the finals, 189 national first prizes, 373 second prizes, and 638 third prizes were awarded.